| Abstract |
Since its first commercialization in early 2019, 5G has been making progress around the world and penetrating daily lives. Now, research interest in wireless communication is quickly shifting to the next generation mobile system, 6G. 5G is not just an evolutionary upgrade of the previous generation of cell phones, but it is a revolutionary technology envisioned that will eliminate the bounds of access, bandwidth, performance, and latency limitations on connectivity worldwide. 5G and beyond have the potential to enable fundamentally new applications, industries, and business models and dramatically improve quality of life around the world via unprecedented use cases that require high data-rate instantaneous communications, low latency, and massive connectivity for new applications for mobile, eHealth, autonomous vehicles, smart cities, smart homes, and the IoT. Therefore, 5G has become a novel driving force for leading innovation and stimulating new types of information consumption, as well as an emerging engine for promoting industrial upgrading and driving sustained economic growth. Through the construction of 5G network systems and the popularization of 5G terminals, components such as base station antennas, filters and communication PCB boards are increasingly demanded. From a technical perspective, ultralow-loss high reliability copper-clad laminate materials employed in 5G high-speed communications, 5G metamaterials and low-loss high-performance RF technology, and 5G low-loss magnetoelectric functional materials have been developed. For materials and devices, multimodule integrated printed circuits for 5G communication base stations, manufacturing of 5G communication optoelectronic integrated cables, and multichannel high linearity and large dynamic range RF optical transceiver integrated modules in terms of 5G mobile communication will show critical significance in various applications. This chapter will give a brief review of perspectives on 5G and beyond applications and related technologies. © 2022, The Author(s), under exclusive license to Springer Nature Switzerland AG. |